WanderRep : a reporting tool for caregivers of wandering persons with dementia

Wandering behaviour is regarded as one of the most difficult to manage for Caregivers of persons with Dementia. It also results in a lot of stress and burden for all caregivers involved, since this behaviour can result in injuries and getting lost. In this research we are proposing a tool which utilizes the currently available Smart Mobile Technologies to focus on the patients’ wandering patterns whilst identifying any possible dangers pertaining to the patient. A number of findings have been collected from this research tool, through a number of studies with both formal and informal caregivers and patients at the St. Vincent de Paul Elderly Nursing Home. These findings primarily relate to: (1) The benefits which caregivers perceive when being alerted of danger relating to their patients and (2) the need for further understanding this research area through the collected data. Caregivers are also given the opportunity to give their feedback on a patient’s exposure to danger, thus creating a cooperative environment between caregivers of the same patient. Preliminary tests have shown how this system achieves an 89% specificity to danger rate, which defines the statistical performance of a binary classification test, together with showing how caregivers find this system as a positive way of reducing their burden when caring for wandering patients.peer-reviewe

Warpage issues in large area mould embedding technologies

The need for higher communications speed, heterogeneous integration and further miniaturisation have increased demand in developing new 3D integrated packaging technologies which include wafer-level moulding and chip-to-wafer interconnections . Wafer-level moulding refers to the embedding of multiple chips or heterogeneous systems on the wafer scale. This can be achieved through a relatively new technology consisting of thermal compression moulding of granular or liquid epoxy moulding compounds. Experimental measurements from compression moulding on 8” blank wafers have shown an unexpected tendency to warp into a cylindrical-shape following cooling from the moulding temperature to room temperature. Wafer warpage occurs primarily as a result of a mismatch between the coefficient of thermal expansion of the resin compound and the Si wafer. This paper will delve into possible causes of such asymmetric warpage related to mould, dimensional and material characteristics using finite element (FE) software (ANSYS Mechanical). The FE model of the resin on wafer deposition will be validated against the measurement results and will be used to deduce appropriate guidelines for low warpage wafer encapsulation.peer-reviewe

Xjenza Online -Journal of The Malta Chamber of Scientists www

Abstract. The need for higher communications speed, heterogeneous integration and further miniaturisation have increased demand in developing new 3D integrated packaging technologies which include wafer-level moulding and chip-to-wafer interconnections. Wafer-level moulding refers to the embedding of multiple chips or heterogeneous systems on the wafer scale. This can be achieved through a relatively new technology consisting of thermal compression moulding of granular or liquid epoxy moulding compounds. Experimental measurements from compression moulding on 8" blank wafers have shown an unexpected tendency to warp into a cylindrical-shape following cooling from the moulding temperature to room temperature. Wafer warpage occurs primarily as a result of a mismatch between the coefficient of thermal expansion of the resin compound and the Si wafer. This paper will delve into possible causes of such asymmetric warpage related to mould, dimensional and material characteristics using finite element (FE) software (ANSYS Mechanical). The FE model of the resin on wafer deposition will be validated against the measurement results and will be used to deduce appropriate guidelines for low warpage wafer encapsulation